Electronics packaging includes the packaging of the
assortment of integrated circuits and other microcomponents in a single
enclosure. Design and manufacturing activities for fabrication of components
and devices in the consumer electronics industry has warranted its need for its
protection. The global electronic packaging market report by
Market Research Future (MRFR) comprises drivers, challenges, trends, and
opportunities for the period of 2019 to 2025 (forecast period). The COVID-19
pandemic and its impact on the industry are highlighted in the report.
Market
Scope
The global electronic packaging market is estimated to reach USD 2254.49 million by 2025,
registering a CAGR of 16.10% during
the forecast period. Huge demand for consumer electronics can be the primary
driver of the market. The penetration of smart devices has induced the need for
electronic packaging of integrated circuits and wafers of nano sizes to cater
to a large consumer base. The advances in internet of things (IoT) and wireless
devices can facilitate market growth over the forecast period.
Integration of product functions or features into a single
package can influence the market to a great extent. This is exemplified by the
constant updates on smartphones which enhance its features significantly.
Furthermore, updates in network communication technologies such as 5G pave open
the path for more opportunities. Rise in autonomous vehicles can be a
significant trendsetter for the industry in the coming years.
Electronic Packaging Market@ https://industrytoday.co.uk/electrical/electronic-packaging-market-estimated-to-experience-a-hike-in-growth---global-industry-size--growth--segments--revenue-and-top-manufacturers--xilinx-inc---gy-packaging--plastiform-inc-
Competitive
Outlook
Major electronic packaging companies profiled are Sealed Air
Corporation, DuPont de Nemours, Inc., Quality Foam Packaging Inc., UFP
Technologies, Inc., Dordan Manufacturing Company, Kiva Container Corporation,
STMicroelectronics NV, Primex Design & Fabrication, Plastiform Inc., The
Box Co-Op, GY Packaging, Intel Corporation, AMETEK Inc., Samsung Electronics
Corporation Ltd, AMS AG, Taiwan Semiconductor Manufacturing Co. Ltd., and
Xilinx Inc.
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Segmentation
The global electronic packaging market has been segmented by
material, packaging technology, and end-user.
·
By
material, the market has been segmented into glass, plastic, metal,
and others.
·
By
packaging technology, the market has been segmented into chip-scale
packages (CSP), through-hole mounting, and surface surface-mount technology
(SMD).
·
By end
user, the market has been segmented into telecommunication,
consumer electronics, aerospace & defense, automotive, and others.
·
By region, the market
has been segmented into North America, Europe, Asia Pacific (APAC), and
Rest-of-the-World (RoW).
Regional
Analysis
According to MRFR analysis, APAC dominated the market in 2018
and is expected to continue during the forecast period due to the rising demand
for consumer electronics across the region. Moreover, the presence of various
electronic packaging companies such as Samsung Electronics Corporation Ltd and
Taiwan Semiconductor Manufacturing Co. Ltd offering material and technology can
further propel the growth of the market in the region.
North America can occupy a significant market share owing to
the proliferation of new communication technologies and large defense
expenditure of prominent nations such as the U.S. and Canada. The use of
drones, guided missiles, and satellites contain integrate circuits which beckon
the use of electronic packaging. The ability to withstand harsh environments
can drive its demand in the region.
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TABLE OF CONTENTS:
1.
Market Introduction
2.
Research Methodology
3.
Market Dynamics
4.
Executive Summary
5.
Market Factor Analysis
6.
Electronic Packaging Market, By Segments
7.
Competitive Analysis
Continued…
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