Market Research Future (MRFR) in the new report on the global
Electronic Packaging market 2020, states determiners and restrains on the
market. The Electronic Packaging Market is
estimated to attain an income worth USD 2254.49 Million by 2025 by registering
a CAGR of 16.10% in the impending period.
The increasing demand for customer electronics is estimated
to play a vital role in the development of the electronic packaging market
share in the forecast period. Moreover, the steadily rising demand for
smartphones is estimated to spur the electronic packaging market in the
approaching period.
Competitive Analysis
The restoration and everyday operations are estimated to take
some time, which will lead to intensive development of backlog in delivery. The
financial assistance provided by the government around the world and trade
bodies is estimated to salvage the situation in the coming years. The downturn
effects visible in the market are estimated to stay a little longer due to the
scale of impact on the global market. The need for prudent analysis of the
market trends and demand projections is estimated to lead to formidable
development in the market.
Top
Companies profiled in Electronic Packaging Market Research Report:
Xilinx Inc. (US), Dordan Manufacturing Company (US), GY
Packaging, (US), Plastiform Inc. (US), Kiva Container Corporation (US), Samsung
Electronics Corporation Ltd (South Korean), The Box Co-Op (US), Quality Foam
Packaging Inc. (US), Sealed Air Corporation (US), DuPont de Nemours, Inc. (the
US), UFP Technologies, Inc. (US), AMETEK Inc. (US), Intel Corporation (US),
STMicroelectronics NV (Switzerland), AMS AG (Austria), Primex Design &
Fabrication (US), Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan),
among others.
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Segmental Analysis
Segmentation
The Global Electronic Packaging Market has been segmented
based on Material, Packaging Technology, End-User, and Region.
·
By
Material, the market has been segmented into plastic, metal, glass,
and others.
·
By
Packaging Technology, the market has been segmented into the through-hole
mounting, surface surface-mount technology (SMD), and chip-scale packages
(CSP).
·
By End
User, the market has been segmented into consumer electronics,
aerospace & defense, automotive, telecommunication, and others.
·
By Region, the market
has been segmented into North America, Europe, Asia-Pacific, and the rest of
the world.
Detailed Regional
Analysis
The regional evaluation of the electronic packaging market is
segmented into regions such as Asia-Pacific, North America, Europe, and the
rest of the regions in the world. The Asia-Pacific region controlled the
electronic packaging market in the year 2018 and is anticipated to direct the
market’s development in the forecast period. The intensifying demand for
consumer electronics across the region is estimated to contribute to the
expansion of the market in the forecast period. Furthermore, the growing
population levels and escalating disposable income in the region are a few of
the main factors which are escalating the demand for consumer electronics. This
development is further enhancing the augmentation of the electronic packaging
market in the region. Moreover, a chief market driver for the region is its
domination in the manufacture of semiconductor devices around the world.
Major Highlights of TOC Covers:
- Executive Summary
- Key Business Trends
- Regional Trends and Growth
- Product Trends
- End-use Trends
- Definition and Forecast Parameters
- Electronic Packaging Market Segmentation
- Electronic Packaging Market Landscape
- Vendor Matrix
- Company Profiles
- Business Overview
- Financial Data
- Product Landscape
More…
If you have any requirements, let know and we will customize the
report according to your need.
FOR MORE DETAILS – https://www.marketresearchfuture.com/reports/electronic-packaging-market-8705
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